BIOS Features | Plug and Play (PnP)DMI 2.3PCI 2.2ACPI 6.2USB Keyboard SupportSMBIOS 3.1.1 |
---|---|
PCI-Express | 3 PCI-E 4.0 x16 slots3 PCI-E 4.0 x8 slots |
Cores | Up to 64 Cores |
Network Controllers | Dual LAN via Broadcom BCM57416 10GBase-T Ethernet Controller |
M.2 | 22110Key: M-Key, Interface: 1 PCI-E 4.0 x4Form Factor: 2280 |
DIMM Sizes | 128GB, 16GB, 256GB, 32GB, 64GB, 8GB |
BIOS Type | AMI 256Mb SPI Flash EEPROM |
LAN | 2x 10GBase-T LAN ports1 RJ45 Dedicated IPMI LAN port |
USB | 2 headers), 2 USB 2.0 ports (rear)4 USB 3.0 ports (2 rear |
Form Factor | E-ATX |
Memory Type | 288-pin gold-plated DIMMs, DDR4 3200 MHz Registered ECC |
Application | Server |
IPMI | Support for Intelligent Platform Management Interface v. 2.0IPMI 2.0 with virtual media over LAN and KVM-over-LAN supportASPEED AST2600 BMC |
Others | 1 COM port (rear)2 SATA DOM power connectors4 PCI-E 4.0 NVMe x4 internal portsTPM 2.0 header |
VGA | 1 VGA port |
Memory Voltage | 1.2V |
CPU | Dual AMD EPYC 7003/7002 Series ProcessorsSocket SP3 |
SATA | 10 SATA3 (6 Gbps) ports |
Memory Capacity | 16 DIMM slotsSupports up to 4TB Registered ECC DDR4 3200MHz SDRAM8-channel memory busFor Dual CPUs: Recommended that memory be populated equally in adjacent memory banks |
Error Detection | Corrects single-bit errorsDetects double-bit errors (using ECC memory) |
Dimensions | 12" x 13.05" (30.5cm x 33.1cm) |
Supermicro MBD-H12DSi-NT6
**Supermicro MBD-H12DSi-NT6**: Dual-socket SP6 motherboard designed for AMD EPYC 9004 Series processors (4th Gen), delivering exceptional scalability and performance for data centers, HPC, AI, and enterprise storage. Features 24 DDR5 DIMM slots (up to 6TB), seven PCIe 5.0 x16 slots for high-speed GPUs/NVMe, triple M.2 slots, eight SATA3 ports, and dual 10G LAN. Integrated ASPEED AST2600 BMC enables advanced remote management. Combines cutting-edge PCIe 5.0 bandwidth, DDR5 efficiency, and AMD’s Zen 4 architecture for unmatched density, reliability, and future-proofed expansion in an E-ATX form factor. Ideal for demanding workloads requiring maximum throughput and low-latency connectivity.
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