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Supermicro SuperBlade Enclosure SBE-820H2-822
$Quote1 Piece (MOQ)Minimum Order Quantity Inquiry
**Supermicro SuperBlade Enclosure SBE-820H2-822: High-Density, Efficient Compute Consolidation**
**Key Features:**
– **Ultra-Dense 8U Chassis:** Houses 20 hot-swappable compute blades (8U form factor).
– **High-Performance Blades:** Supports AMD EPYC™-based blades (e.g., SYS-620H-TNR) with up to 128 cores, 4TB RAM, and dual GPUs per node.
– **Integrated Networking:** 10GbE/40GbE switching with low-latency fabric options (NVMe-oF, InfiniBand).
– **Shared Redundant Infrastructure:** Centralized, hot-swappable 3200W Titanium PSUs (N+1/N+N) and cooling fans.
– **Unified Management:** Single Supermicro Blade Management (SBM) interface for chassis, nodes, power, and cooling.
– **Massive Storage Capacity:** Up to 100TB per chassis via optional front-loading NVMe/U.2 storage blades.**Benefits:**
– **Space & Power Efficiency:** Consolidates 20 servers into 8U, reducing rack space and power/cooling costs by up to 40%.
– **Scalability:** Modular “pay-as-you-grow” design; scale compute/storage independently.
– **High Availability:** Redundant components and hot-swap capability minimize downtime.
– **Simplified Operations:** Centralized management streamlights deployment, monitoring, and maintenance.
– **Optimized Performance:** High-speed interconnects and GPU support for AI/HPC workloads.**Unique Selling Points:**
– **Industry-Leading Density:** Highest blade count (20) in an 8U enclosure.
– **AMD EPYC™ Optimization:** Maximizes core density and TCO for cloud/enterprise workloads.
– **Thermal Efficiency:** Patented thermal design enables sustained high performance without throttling.
– **Flexible Storage:** Unique front-loading NVMe blades for dedicated high-speed storage expansion.
– **Eco-Friendly:** Titanium-level PSUs (96%+ efficiency) reduce operational costs and carbon footprint.

