| BIOS Features | Plug and Play (PnP)DMI 2.3PCI 2.2ACPI 5.1USB Keyboard SupportSMBIOS 3.1.1 |
|---|---|
| PCI-Express | 5 PCI-E 4.0 x162 PCI-E 4.0 x8 |
| Cores | Up to 64 Cores |
| Network Controllers | Dual 10GBase-T LAN via Broadcom BCM574161 Realtek RTL8211F PHY (dedicated IPMI) |
| M.2 | 22110Key: M-Key, Interface: 2 PCI-E 4.0 x4Form Factor: 2280 |
| DIMM Sizes | 128GB, 16GB, 256GB, 32GB, 64GB, 8GB |
| BIOS Type | AMI 256Mb SPI Flash EEPROM |
| LAN | Dual 10GBase-T LAN ports1 RJ45 Dedicated IPMI LAN port |
| USB | 6 USB 3.0 ports |
| Form Factor | ATX |
| Memory Type | 288-pin gold-plated DIMMs, DDR4 3200 MHz Registered ECC |
| Application | Server |
| IPMI | Support for Intelligent Platform Management Interface v.2.0IPMI 2.0 with virtual media over LAN and KVM-over-LAN supportASPEED AST2500 BMC |
| Others | 1 COM port (rear)2 SATA DOM power connectors1 TPM 2.0 header |
| VGA | 1 VGA port |
| Memory Voltage | 1.2V |
| CPU | Single AMD EPYC 7003/7002 Series ProcessorSocket SP3 |
| SAS | 8 SAS3 (12 Gbps) ports |
| SATA | 8 SATA3 (6 Gbps) ports |
| Memory Capacity | 8 DIMM slotsSupports up to 2TB Registered ECC DDR4 3200MHz SDRAM8-channel memory bus |
| Error Detection | Corrects single-bit errorsDetects double-bit errors (using ECC memory) |
| Dimensions | 12" x 9.6" (30.5cm x 24.4cm) |
Supermicro MBD-H12SSL-CT-O
Supermicro MBD-H12SSL-CT-O is a high-performance server motherboard designed for data centers and enterprise environments. Built for AMD EPYC 7003 series processors (single/dual SP3 socket), it delivers exceptional scalability and compute density with PCIe 4.0 support, enabling ultra-fast data transfer for GPUs, NVMe, and networking. Features include 8 DDR4 DIMM slots (3200+ MHz), 6 SATA3 ports, dual M.2 slots, and 3 PCIe 4.0 x16 expansion slots. Integrated dual 10G LAN ensures high-speed connectivity, while an onboard BMC chip enables remote management via IPMI for seamless monitoring and maintenance. Optimized for reliability and security, it includes TPM 2.0 support and is tailored for cloud, storage, and HPC workloads. Its compact form factor, energy efficiency, and robust I/O make it ideal for scalable, high-performance infrastructure deployments.
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